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    首頁產(chǎn)品索引MAQ4124

    MAQ4124

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    中文數(shù)據(jù)手冊(cè)

    產(chǎn)品信息

    The MAQ4123/MAQ4124/MAQ4125 are a family of dual 3A buffer/MOSFET drivers intended for driving power MOSFETs, IGBTs, and other heavy loads (capacitive, resistive or inductive) which require low-impedance, high peak currents and fast switching times. They are available in inverting, non-inverting, and complementary configurations.The MAQ4123/MAQ4124/MAQ4125 operate from a 4.5V to 20V supply, feature an output resistance of 2.3Ω, sink or source 3A of peak current, and switch an 1800pF capacitive load in 10ns with typical propagation delay times of 50ns.The MAQ4123/MAQ4124/MAQ4125 feature TTL or CMOS compatible inputs with 400mV of hysteresis to provide noise immunity. The inputs can withstand negative voltage swings of 5V and are latch-up protected to withstand 200mA of reverse current.The MAQ4123/MAQ4124/MAQ4125 are rated for the -40°C to +125°C operating temperature range, have been AEC-Q100 qualified for automotive applications, and are available in the ePad SOIC-8 package for improved power dissipation and thermal performance required by automotive applications.

      Automotive AEC-Q100 Qualified

      High ±3A peak output current

      Wide 4.5V to 20V supply voltage range

      Low 2.3Ω output resistance

      Matched rise and fall times

      Fast 10ns rise/fall times with 1800pF capacitive load

      Low propagation delay time of 50ns (typical)

      TTL/CMOS logic inputs independent of supply voltage

      Latch-up protected to 200mA reverse current

      Logic input withstands swing to -5V

      Low equivalent 6pF input capacitance

      Output voltage swings within 25mV of ground or VS

      Low supply current

      2.0mA with logic-1 input (maximum over temperature)

      300μA with logic-0 input (maximum over temperature)

      '426/7/8-, '1426/7/8-, '4426/7/8 industry standard pin out

      Inverting, non-inverting, and differential configurations

      -40°C to +125°C temperature range

      Exposed backside pad (ePad) packaging for improved power dissipation

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