Key Features

• Bluetooth specification v4.0 compliant master and slave single-mode Bluetooth low energy network processor

• Embedded Bluetooth low energy protocol stack: GAP, GATT, SM, L2CAP, LL, RF-PHY

• Bluetooth low energy profiles provided separately

• Operating supply voltage: from 2.0 to 3.6 V

• 8.2 mA maximum TX current (@0 dBm, 3.0 V)

• Down to 1.7 μA current consumption with active BLE stack

• Integrated linear regulator and DC-DC step-down converter

• Up to +8 dBm available output power (at antenna connector)

• Excellent RF link budget (up to 96 dB)

• Accurate RSSI to allow power control

• Proprietary application controller interface (ACI), SPI based, allows interfacing with an external host application microcontroller

• Full link controller and host security

• High performance, ultra-low power Cortex-M0 32-bit based architecture core

• On-chip non-volatile Flash memory

• AES security co-processor

• Low power modes

• 16 or 32 MHz crystal oscillator

• 12 MHz ring oscillator

• 32 kHz crystal oscillator

• 32 kHz ring oscillator

• Compliant with the following radio frequency regulations: ETSI EN 300 328, EN 300 440, FCC CFR47 Part 15, ARIB STD-T66

• Available in QFN32 (5 x 5 mm) and WLCSP34 (2.66 x 2.56 mm) packages

• Operating temperature range: -40 °C to 85 °C

主要特點

藍(lán)牙規(guī)范V4.0兼容的主從單模低功耗藍(lán)牙網(wǎng)絡(luò)處理器

嵌入式低功耗藍(lán)牙協(xié)議棧：差距，關(guān)貿(mào)總協(xié)定、SM、L2CAP、LL、rf-phy

藍(lán)牙低能量配置文件單獨提供

操作電源電壓：從2到3.6伏

8.2 mA最大TX電流（@ 0 dBm時，3 V）

到1.7μ與活躍的BLE堆棧的電流消耗

集成線性穩(wěn)壓器和DC-DC降壓轉(zhuǎn)換器

高達(dá)8 dBm的輸出功率（在天線連接器）

出色的射頻鏈路預(yù)算（高達(dá)96分貝）

允許功率控制準(zhǔn)確的RSSI

專有的應(yīng)用程序接口（ACI），基于SPI的，允許外部主機應(yīng)用的微控制器接口

全鏈路控制器和主機安全

高性能、超低功耗的Cortex-M0 32位架構(gòu)的核心

片上非揮發(fā)性快閃記憶體

AES安全協(xié)處理器

低功率模式

16或32兆赫晶體振蕩器

12兆赫環(huán)形振蕩器

32千赫晶體振蕩器

32千赫環(huán)形振蕩器

符合下列規(guī)定：300射頻ETSI EN 328，EN 300 440，F(xiàn)CC cfr47部分15、ARIB std-t66

可在qfn32（5 x 5毫米）和wlcsp34（2.66×2.56毫米）封裝

工作溫度范圍：- 40°為85°