The LPS331AP is an ultra compact absolute piezoresistive pressure sensor. It includes a monolithic sensing element and an IC interface able to take the information from the sensing element and to provide a digital signal to the external world.

The sensing element consists of a suspended membrane realized inside a single mono-silicon substrate. It is capable to detecting pressure and is manufactured using a dedicated process developed by ST, called VENSENS.

The VENSENS process allows to build a mono-silicon membrane above an air cavity with controlled gap and defined pressure. The membrane is very small compared to the traditionally built silicon micromachined membranes. Membrane breakage is prevented by an intrinsic mechanical stopper.

The IC interface is manufactured using a standard CMOS process that allows a high level of integration to design a dedicated circuit which is trimmed to better match the sensing element characteristics.

The LPS331AP is available in a small holed cap land grid array (HCLGA) package and it is guaranteed to operate over a temperature range extending from -40 °C to +85 °C. The package is holed to allow external pressure to reach the sensing element.

lps331ap是一種超小型絕對壓阻式壓力傳感器。它包括一個(gè)單片傳感元件和一個(gè)集成電路接口能夠從傳感元件的信息，并提供一個(gè)數(shù)字信號到外部世界。

該傳感元件由一個(gè)單一的單體硅襯底上實(shí)現(xiàn)的懸浮膜。它能夠檢測壓力，使用專用的過程由ST開發(fā)制造，稱為vensens。

的vensens過程允許建立一個(gè)單一的硅膜上方空氣腔間隙和壓力控制的定義。與傳統(tǒng)的硅微機(jī)械膜相比，該膜是非常小的。防止膜破裂的內(nèi)在機(jī)械塞。

IC接口采用標(biāo)準(zhǔn)的CMOS工藝，允許高層次的集成設(shè)計(jì)專用電路，修整，以更好地匹配傳感元件特性制造。

在一個(gè)小的lps331ap孔帽柵格陣列是可用的（hclga）封裝，這是保證工作在擴(kuò)展溫度范圍從- 40°C + 85°C.包裝孔允許外部壓力達(dá)到傳感元件。

Key Features

• 260 to 1260 mbar absolute pressure range

• High-resolution mode: 0.020 mbar RMS

• Low power consumption:

• Low resolution mode: 5.5 μA

• High resolution mode: 30 μA

• High overpressure capability: 20x full scale

• Embedded temperature compensation

• Embedded 24-bit ADC

• Selectable ODR from 1 Hz to 25 Hz

• SPI and I2C interfaces

• Supply voltage: 1.71 to 3.6 V

• High shock survivability: 10,000 g

• Small and thin package

• ECOPACK? lead-free compliant

主要特點(diǎn)

260到1260毫巴絕對壓力范圍

高分辨率模式：0.020 mbar RMS

低功耗：

低分辨模式：5.5

高分辨模式：30

高過壓能力：20X全面

嵌入式溫度補(bǔ)償

嵌入式24位ADC

可選的ODR從1赫茲到25赫茲

SPI和I2C接口

電源電壓：1.71至3.6伏

高沖擊生存能力：10000克

小而薄的包裝

?ECOPACK無鉛兼容