優(yōu)勢和特點

  Application-tuned peripherals provide glueless connectivity to general-purpose converters in data acquisition applications

  Large on-chip SRAM for maximum system performance

產(chǎn)品詳情

The ADSP-BF533 provides a high performance, power-efficient processor choice for today's most demanding convergent signal processing applications.The high performance 16-bit/32-bit Blackfin? embedded processor core, the flexible cache architecture, the enhanced DMA subsystem, and the dynamic power management (DPM) functionality allow system designers a flexible platform to address a wide range of applications including consumer,communications, automotive, and industrial/instrumentation.

  High performance 16-bit/32-bit embedded processor core

  10-stage RISC MCU/DSP pipeline with mixed 16-bit/32-bit ISA for optimal code density

  Full SIMD architecture, including instructions for accelerated video and image processing

  Memory management unit (MMU) supporting full memory protection for an isolated and secure environment

  Up to 148 kB of on-chip SRAM

  Glueless video capture and display port

  Two dual-channel, full-duplex, synchronous serial ports supporting eight stereo I2S channels

  12 DMA channels supporting one- and two-dimensional data transfers

  Memory controller providing glueless connection to multiple banks of external SDRAM, SRAM, Flash, or ROM

  160-ball mini-BGA, 169-ball PBGA packages

  Industrial temperature ranges (40°C to 85°C) and commercial temperature ranges (0°C to 70°C) available